Copper CMP Clean Solution

Copper CMP Clean Solution is a post-chemical mechanical planarization (CMP) cleaning formulation based on deionized water and citric acid designed for removing residual slurry particles, copper oxides, and organic contaminants from wafer surfaces after copper CMP processing. Effective post-CMP cleaning is critical in copper interconnect manufacturing to prevent defects, ensure reliable via connections, and maintain device yield. The citric acid component acts as a chelating agent that complexes dissolved copper ions, preventing re-deposition and galvanic corrosion on exposed metal surfaces. This solution is compatible with standard post-CMP brush scrubber and megasonic cleaning tools.

Key Technical Features

• High Purity Grade standard
• Consistent Batch Quality
• Full Regulatory & REACH Support
• Global Logistics Network enabled