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Buffered Oxide Etchant (BOE/BHF)

CAS Number
12125-01-8 / 7664-39-3
EC Number
Unspecified
Chemical Formula
NH4F + HF
Molecular Weight
Mixture g/mol

Description

Buffered Oxide Etchant (BOE), also known as Buffered HF (BHF), is a critical wet etching solution composed of ammonium fluoride and hydrofluoric acid used extensively in semiconductor, flat panel display, photovoltaic, and LED manufacturing. The buffered formulation provides controlled and uniform silicon dioxide etching with superior etch rate stability compared to dilute HF alone. BOE is essential for oxide patterning, pre-diffusion cleaning, and post-CMP oxide removal in advanced device fabrication. The ammonium fluoride buffer maintains consistent fluoride ion concentration throughout the etch process, ensuring predictable etch rates and excellent selectivity to silicon and silicon nitride. Available in multiple ratios (6:1, 7:1, 10:1, 20:1) to match specific process requirements for etch rate and selectivity.

Other Names (Synonyms)

BOE, BHF, Buffered HF, Buffered Hydrofluoric Acid

Key Technical Features

  • High Purity Grade standard
  • Consistent Batch Quality
  • Full Regulatory & REACH Support
  • Global Logistics Network enabled

Physical Properties

Appearanceclear colorless liquid
Density1.06-1.15 g/cm³ (varies by ratio)
pH<1
Boiling Point~106 °C

Safety & Handling

Danger
GHS05· CorrosiveGHS06· Toxic

Hazard Statements

H300Fatal if swallowed
H310Fatal in contact with skin
H314Causes severe skin burns and eye damage
H330Fatal if inhaled

Precautionary Statements

P260Do not breathe vapours
P280Wear protective gloves/protective clothing/eye protection/face protection
P284Wear respiratory protection
P310IF SWALLOWED: Immediately call a POISON CENTER

Trade & Regulatory

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